Shear stress modeling of ACA joints in thermal tests

Kirsi Saarinen; Laura Frisk

doi:10.1109/ESimE.2012.6191715

Shear stress modeling of ACA joints in thermal tests

Kirsi Saarinen
, Laura Frisk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Translated title of the contribution	Shear stress modeling of ACA joints in thermal tests
Original language	English
Title of host publication	13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal
Editors	L.J. Ernst, G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1-8
Number of pages	8
ISBN (Electronic)	978-1-4673-1513-5
ISBN (Print)	978-146731512-8
DOIs	https://doi.org/10.1109/ESimE.2012.6191715
Publication status	Published - 2012
Publication type	A4 Article in conference proceedings

Publication series

Name	IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Publication forum classification

No publication forum level

Access to Document

10.1109/ESimE.2012.6191715

Cite this

Saarinen, K., & Frisk, L. (2012). Shear stress modeling of ACA joints in thermal tests. In L. J. Ernst, G. Q. Zhang, W. D. Van Driel, P. Rodgers, C. Bailey, & O. de Saint Leger (Eds.), 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal (pp. 1-8). (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems). IEEE. https://doi.org/10.1109/ESimE.2012.6191715

Saarinen, Kirsi ; Frisk, Laura. / Shear stress modeling of ACA joints in thermal tests. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. editor / L.J. Ernst ; G.Q. Zhang ; W.D. Van Driel ; P. Rodgers ; C. Bailey ; O. de Saint Leger. Piscataway, NJ : IEEE, 2012. pp. 1-8 (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems).

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title = "Shear stress modeling of ACA joints in thermal tests",

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doi = "10.1109/ESimE.2012.6191715",

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Saarinen, K & Frisk, L 2012, Shear stress modeling of ACA joints in thermal tests. in LJ Ernst, GQ Zhang, WD Van Driel, P Rodgers, C Bailey & O de Saint Leger (eds), 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, IEEE, Piscataway, NJ, pp. 1-8. https://doi.org/10.1109/ESimE.2012.6191715

Shear stress modeling of ACA joints in thermal tests. / Saarinen, Kirsi; Frisk, Laura.
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. ed. / L.J. Ernst; G.Q. Zhang; W.D. Van Driel; P. Rodgers; C. Bailey; O. de Saint Leger. Piscataway, NJ: IEEE, 2012. p. 1-8 (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

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AU - Frisk, Laura

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PY - 2012

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DO - 10.1109/ESimE.2012.6191715

M3 - Conference contribution

SN - 978-146731512-8

T3 - IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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BT - 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal

A2 - Ernst, L.J.

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Saarinen K, Frisk L. Shear stress modeling of ACA joints in thermal tests. In Ernst LJ, Zhang GQ, Van Driel WD, Rodgers P, Bailey C, de Saint Leger O, editors, 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. Piscataway, NJ: IEEE. 2012. p. 1-8. (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems). doi: 10.1109/ESimE.2012.6191715