Solder bump reliability - Issues on bump layout

T. Alander, P. Heino, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

13 Citations (Scopus)

Translated title of the contribution	Solder bump reliability - Issues on bump layout
Original language	English
Pages (from-to)	715-720
Journal	IEEE Transactions on Aerospace and Electronic Systems
Volume	23
Issue number	4
Publication status	Published - 2000
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Solder bump reliability - Issues on bump layout",

author = "T. Alander and P. Heino and E. Ristolainen",

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year = "2000",

language = "English",

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journal = "IEEE Transactions on Aerospace and Electronic Systems",

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T1 - Solder bump reliability - Issues on bump layout

AU - Alander, T.

AU - Heino, P.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2000

Y1 - 2000

M3 - Article

SN - 0018-9251

VL - 23

SP - 715

EP - 720

JO - IEEE Transactions on Aerospace and Electronic Systems

JF - IEEE Transactions on Aerospace and Electronic Systems

IS - 4

ER -