Solder bump reliability - Issues on bump layout

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13 Citations (Scopus)

Translated title of the contribution	Solder bump reliability - Issues on bump layout
Original language	English
Pages (from-to)	715-720
Journal	IEEE Transactions on Aerospace and Electronic Systems
Volume	23
Issue number	4
Publication status	Published - 2000
Publication type	A1 Journal article-refereed

Publication forum classification

@article{1d7e7591dc6e45fcb203b9d3015e0779,

title = "Solder bump reliability - Issues on bump layout",

author = "T. Alander and P. Heino and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",

year = "2000",

language = "English",

volume = "23",

pages = "715--720",

journal = "IEEE Transactions on Aerospace and Electronic Systems",

issn = "0018-9251",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Solder bump reliability - Issues on bump layout

AU - Alander, T.

AU - Heino, P.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2000

Y1 - 2000

M3 - Article

SN - 0018-9251

VL - 23

SP - 715

EP - 720

JO - IEEE Transactions on Aerospace and Electronic Systems

JF - IEEE Transactions on Aerospace and Electronic Systems

IS - 4

ER -