Static Bending of Flip-Chip Structures Under Humid Conditions

Kati Kokko; Kirsi Saarinen; Milad Mostofizadeh; Laura Frisk

doi:10.1109/TCPMT.2013.2243498

Static Bending of Flip-Chip Structures Under Humid Conditions

Kati Kokko, Kirsi Saarinen, Milad Mostofizadeh, Laura Frisk

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Translated title of the contribution	Static Bending of Flip-Chip Structures Under Humid Conditions
Original language	English
Pages (from-to)	1163-1170
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	3
Issue number	7
DOIs	https://doi.org/10.1109/TCPMT.2013.2243498
Publication status	Published - 2013
Publication type	A1 Journal article-refereed

Publication forum classification

Publication forum level 1

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10.1109/TCPMT.2013.2243498

Cite this

@article{5bceaa6645644ea09506da78cd465e97,

title = "Static Bending of Flip-Chip Structures Under Humid Conditions",

author = "Kati Kokko and Kirsi Saarinen and Milad Mostofizadeh and Laura Frisk",

note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2013-11-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",

year = "2013",

doi = "10.1109/TCPMT.2013.2243498",

language = "English",

volume = "3",

pages = "1163--1170",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers",

number = "7",

}

TY - JOUR

T1 - Static Bending of Flip-Chip Structures Under Humid Conditions

AU - Kokko, Kati

AU - Saarinen, Kirsi

AU - Mostofizadeh, Milad

AU - Frisk, Laura

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2013-11-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2013

Y1 - 2013

U2 - 10.1109/TCPMT.2013.2243498

DO - 10.1109/TCPMT.2013.2243498

M3 - Article

SN - 2156-3950

VL - 3

SP - 1163

EP - 1170

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 7

ER -