Stress corrosion cracking performance of LPBF-built 316L stainless steel post-processed with heat treatment and severe shot peening

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Abstract

This study investigated stress corrosion cracking (SCC) susceptibility in laser powder bed fusion (LPBF) printed 316L stainless steel under corrosive conditions. LPBF process inherently introduces residual stresses and surface defects that can compromise material integrity in aggressive environments. Post-processing techniques, specifically severe shot peening (SSP), heat treatments at 600°C and 900°C, and their combinations were employed to mitigate these issues. SCC testing in a boiling 25% NaCl solution assessed cracking over a period of five weeks. The results demonstrate that while SSP initially introduced compressive residual stresses potentially enhancing SCC resistance, subsequent mechanical deformation by U-bending diminished these benefits, leading to increased susceptibility to cracking. Tensile stresses induced by U-bending appeared to override the benefits of defect closure and reduced surface roughness, resulting in cracking. Notably, only specimens subjected to AB + SSP and HT600 + SSP conditions exhibited cracking during the testing period, highlighting the complex interplay between residual stresses, mechanical deformation, and SCC behaviour.

Original languageEnglish
Article numbere2406414
Number of pages15
JournalVirtual and Physical Prototyping
Volume19
Issue number1
DOIs
Publication statusPublished - 2024
Publication typeA1 Journal article-refereed

Funding

The author, T.G., would like to thank Tekniikan Edistämissäätiö for the financial support, grant number 9377. The authors would like to express their gratitude to Senior Laboratory Technician Rauli Mäkinen for his assistance with the U-bending.

FundersFunder number
Tekniikan edistämissäätiö9377

    Keywords

    • Additive manufacturing
    • heat treatment
    • severe shot peening
    • stainless steel 316l
    • stress corrosion cracking

    Publication forum classification

    • Publication forum level 1

    ASJC Scopus subject areas

    • Signal Processing
    • Modelling and Simulation
    • Computer Graphics and Computer-Aided Design
    • Industrial and Manufacturing Engineering

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