Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

M. Arra, D. Shangguan, D. Xie, J. Sundelin, T. Lepistö, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

34 Citations (Scopus)

Translated title of the contribution	Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications
Original language	English
Pages (from-to)	977-990
Journal	Journal of Electronic Materials
Volume	33
Issue number	9
Publication status	Published - 2004
Externally published	Yes
Publication type	A1 Journal article-refereed

Publication forum classification

@article{f2b2d406c4e94501891f0c7b42a4bfb5,

title = "Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications",

author = "M. Arra and D. Shangguan and D. Xie and J. Sundelin and T. Lepist{\"o} and E. Ristolainen",

note = "Contribution: organisation=mol,FACT1=1",

year = "2004",

language = "English",

volume = "33",

pages = "977--990",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Institute of Electrical and Electronics Engineers",

number = "9",

}

TY - JOUR

T1 - Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

AU - Arra, M.

AU - Shangguan, D.

AU - Xie, D.

AU - Sundelin, J.

AU - Lepistö, T.

AU - Ristolainen, E.

N1 - Contribution: organisation=mol,FACT1=1

PY - 2004

Y1 - 2004

M3 - Article

SN - 0361-5235

VL - 33

SP - 977

EP - 990

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 9

ER -