System integration issues for stacked 3D package

K. Kaija, M. Mäntysalo, J. Miettinen, P. Heino

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	System integration issues for stacked 3D package
Original language	English
Title of host publication	15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Brugge, Belgium
Pages	96-100
Publication status	Published - 2005
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{2db8ba20c914463fbd1603d03033c2a6,

title = "System integration issues for stacked 3D package",

author = "K. Kaija and M. M{\"a}ntysalo and J. Miettinen and P. Heino",

note = "Contribution: organisation=ele,FACT1=1",

year = "2005",

language = "English",

pages = "96--100",

booktitle = "15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Brugge, Belgium",

}