@inproceedings{beccf710f73e441c86ba1d5b1ce6f66e,
title = "The adhesion of sputter-deposited copper on some organic substrates",
author = "T. Uusluoto and H. Laaksonen and A. Tuominen",
note = "ISBN 80-239-2835-X<br/>Contribution: organisation=pori etp,FACT1=1",
year = "2004",
language = "English",
pages = "105--110",
booktitle = "Sikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004",
}