The development and reliability of small pitch flip chip on flex process

P. Palm, J. Määttänen, A. Tuominen, P. Jalonen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    1 Citation (Scopus)
    Translated title of the contributionThe development and reliability of small pitch flip chip on flex process
    Original languageEnglish
    Title of host publicationAdvances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea
    EditorsS. B. Lee, K. W. Paik
    Pages428-432
    Publication statusPublished - 2001
    Publication typeA4 Article in a conference publication

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