The effect of core material surface roughness on line accuracy using electrodeposited photoresist

P. Jalonen; A. Tuominen

The effect of core material surface roughness on line accuracy using electrodeposited photoresist

P. Jalonen
, A. Tuominen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	The effect of core material surface roughness on line accuracy using electrodeposited photoresist
Original language	English
Title of host publication	EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon
Editors	J.K. Kim
Pages	156-159
Publication status	Published - 2000
Publication type	A4 Article in conference proceedings

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Cite this

@inproceedings{253194cc36754ddbb2a5b027fd7a9f15,

title = "The effect of core material surface roughness on line accuracy using electrodeposited photoresist",

author = "P. Jalonen and A. Tuominen",

note = "ISBN 0-7803-6654-9<br/>Contribution: organisation=pori ttp,FACT1=1",

year = "2000",

language = "English",

isbn = "0-7803-6654-9",

pages = "156--159",

editor = "J.K. Kim",

booktitle = "EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon",

}

The effect of core material surface roughness on line accuracy using electrodeposited photoresist. / Jalonen, P.; Tuominen, A.
EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon. ed. / J.K. Kim. 2000. p. 156-159.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - The effect of core material surface roughness on line accuracy using electrodeposited photoresist

AU - Jalonen, P.

AU - Tuominen, A.

N1 - ISBN 0-7803-6654-9<br/>Contribution: organisation=pori ttp,FACT1=1

PY - 2000

Y1 - 2000

M3 - Conference contribution

SN - 0-7803-6654-9

SP - 156

EP - 159

BT - EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon

A2 - Kim, J.K.

ER -