The effect of humidity on reliability of flip chip joints on flexible LCP and PI substrates

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	The effect of humidity on reliability of flip chip joints on flexible LCP and PI substrates
Original language	English
Title of host publication	Proceedings of the IMAPS Nordic Annual Conference, Helsingor, Denmark, 26-28 September 2004
Pages	196-201
Publication status	Published - 2004
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{9eee1489ede7460fbbcaa9d3826d1d15,

title = "The effect of humidity on reliability of flip chip joints on flexible LCP and PI substrates",

author = "L. Frisk and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2004",

language = "English",

pages = "196--201",

booktitle = "Proceedings of the IMAPS Nordic Annual Conference, Helsingor, Denmark, 26-28 September 2004",

}