The effect of melting time on lead-free solder strength

K. Määttänen; J. Happonen; A. Tuominen

The effect of melting time on lead-free solder strength

K. Määttänen
, J. Happonen
, A. Tuominen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Translated title of the contribution	The effect of melting time on lead-free solder strength
Original language	English
Title of host publication	Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea
Editors	S. B. Lee, K. W. Paik
Pages	225-228
Publication status	Published - 2001
Publication type	A4 Article in conference proceedings

Publication forum classification

No publication forum level

Cite this

@inproceedings{184f5528de484d5ea4bf1a97d7ad8535,

title = "The effect of melting time on lead-free solder strength",

author = "K. M{\"a}{\"a}tt{\"a}nen and J. Happonen and A. Tuominen",

note = "ISBN 0-7803-7157-7<br/>Contribution: organisation=pori etp,FACT1=1",

year = "2001",

language = "English",

pages = "225--228",

editor = "Lee, \{S. B.\} and Paik, \{K. W.\}",

booktitle = "Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea",

}

The effect of melting time on lead-free solder strength. / Määttänen, K.; Happonen, J.; Tuominen, A.
Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea. ed. / S. B. Lee; K. W. Paik. 2001. p. 225-228.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - The effect of melting time on lead-free solder strength

AU - Määttänen, K.

AU - Happonen, J.

AU - Tuominen, A.

N1 - ISBN 0-7803-7157-7<br/>Contribution: organisation=pori etp,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SP - 225

EP - 228

BT - Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea

A2 - Lee, S. B.

A2 - Paik, K. W.

ER -