The effect of roughness and pattern of the core material to adhesion in making build-up layers

P. Jalonen; A. Tuominen

The effect of roughness and pattern of the core material to adhesion in making build-up layers

P. Jalonen, A. Tuominen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Translated title of the contribution	The effect of roughness and pattern of the core material to adhesion in making build-up layers
Original language	English
Title of host publication	Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea
Editors	S. B. Lee, K. W. Paik
Pages	88-92
Publication status	Published - 2001
Publication type	A4 Article in conference proceedings

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Cite this

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title = "The effect of roughness and pattern of the core material to adhesion in making build-up layers",

author = "P. Jalonen and A. Tuominen",

note = "ISBN 0-7803-7157-7<br/>Contribution: organisation=pori etp,FACT1=1",

year = "2001",

language = "English",

pages = "88--92",

editor = "Lee, {S. B.} and Paik, {K. W.}",

booktitle = "Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea",

}

The effect of roughness and pattern of the core material to adhesion in making build-up layers. / Jalonen, P.; Tuominen, A.

Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea. ed. / S. B. Lee; K. W. Paik. 2001. p. 88-92.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - The effect of roughness and pattern of the core material to adhesion in making build-up layers

AU - Jalonen, P.

AU - Tuominen, A.

N1 - ISBN 0-7803-7157-7<br/>Contribution: organisation=pori etp,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SP - 88

EP - 92

BT - Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea

A2 - Lee, S. B.

A2 - Paik, K. W.

ER -