Translated title of the contribution | The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints |
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Original language | English |
Pages (from-to) | 28-37 |
Journal | Soldering and Surface Mount Technology |
Volume | 18 |
Issue number | 4 |
Publication status | Published - 2006 |
Publication type | A1 Journal article-refereed |
Publication forum classification
- Publication forum level 1