The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

L. Frisk, K. Kokko

    Research output: Contribution to journalArticleScientificpeer-review

    19 Citations (Scopus)
    Translated title of the contributionThe effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints
    Original languageEnglish
    Pages (from-to)28-37
    JournalSoldering and Surface Mount Technology
    Volume18
    Issue number4
    Publication statusPublished - 2006
    Publication typeA1 Journal article-refereed

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