The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

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19 Citations (Scopus)

Translated title of the contribution	The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints
Original language	English
Pages (from-to)	28-37
Journal	Soldering and Surface Mount Technology
Volume	18
Issue number	4
Publication status	Published - 2006
Publication type	A1 Journal article-refereed

Publication forum classification

@article{0aa48774592643f3b75ecd6798599cd1,

title = "The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints",

author = "L. Frisk and K. Kokko",

note = "Contribution: organisation=ele,FACT1=1",

year = "2006",

language = "English",

volume = "18",

pages = "28--37",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Publishing",

number = "4",

}