The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags

Kirsi Saarinen, Laura Frisk

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5 Citations (Scopus)

Translated title of the contribution	The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags
Original language	English
Pages (from-to)	10-15
Journal	Journal of Microelectronics and Electronic Packaging
Volume	8
Issue number	1
DOIs	https://doi.org/10.4071/imaps.279
Publication status	Published - 2011
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags",

author = "Kirsi Saarinen and Laura Frisk",

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T1 - The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags

AU - Saarinen, Kirsi

AU - Frisk, Laura

N1 - ei ut-numeroa 10.5.2014<br/>Contribution: organisation=ele,FACT1=1

PY - 2011

Y1 - 2011

U2 - 10.4071/imaps.279

DO - 10.4071/imaps.279

M3 - Article

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JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

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