The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs

S. Nurmi, J. Sundelin, E. Ristolainen, T. Lepistö

Research output: Contribution to journal › Article › Scientific › peer-review

20 Citations (Scopus)

Translated title of the contribution	The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs
Original language	English
Pages (from-to)	31-38
Journal	Soldering and Surface Mount Technology
Volume	15
Issue number	1
Publication status	Published - 2003
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs",

author = "S. Nurmi and J. Sundelin and E. Ristolainen and T. Lepist{\"o}",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

volume = "15",

pages = "31--38",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Group Publishing Ltd.",

number = "1",

}

TY - JOUR

T1 - The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs

AU - Nurmi, S.

AU - Sundelin, J.

AU - Ristolainen, E.

AU - Lepistö, T.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2003

Y1 - 2003

M3 - Article

SN - 0954-0911

VL - 15

SP - 31

EP - 38

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

IS - 1

ER -