The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate

S. Kuusiluoma, J. Kiilunen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    7 Citations (Scopus)
    Translated title of the contributionThe reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate
    Original languageEnglish
    Title of host publicationProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 7-9 December 2005, Singapore
    EditorsY.C. Mui
    Pages774-779
    Publication statusPublished - 2005
    Publication typeA4 Article in conference proceedings

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