The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate

S. Kuusiluoma, J. Kiilunen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Translated title of the contribution	The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate
Original language	English
Title of host publication	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 7-9 December 2005, Singapore
Editors	Y.C. Mui
Pages	774-779
Publication status	Published - 2005
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{58ef2e1347c34c028b0c015426c9c3e2,

title = "The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate",

author = "S. Kuusiluoma and J. Kiilunen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2005",

language = "English",

pages = "774--779",

editor = "Y.C. Mui",

booktitle = "Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 7-9 December 2005, Singapore",

}

The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate. / Kuusiluoma, S.; Kiilunen, J.
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 7-9 December 2005, Singapore. ed. / Y.C. Mui. 2005. p. 774-779.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate

AU - Kuusiluoma, S.

AU - Kiilunen, J.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2005

Y1 - 2005

M3 - Conference contribution

SP - 774

EP - 779

BT - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 7-9 December 2005, Singapore

A2 - Mui, Y.C.

ER -