The reliability of lead-free solder paste in mechanical cycling

K. Määttänen, A. Tuominen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Translated title of the contributionThe reliability of lead-free solder paste in mechanical cycling
    Original languageEnglish
    Title of host publicationJulkaisusarja A - Tampereen teknillinen yliopisto, Porin yksikkö. Elektroniikan valmistus 2003, Elektroniikan tuotanto- ja pakkaustekniikan konferenssi Porissa 22.-23.5.2003
    Pages180-183
    Publication statusPublished - 2003
    Publication typeB3 Non-refereed article in conference proceedings

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