The reliability of lead-free solder paste in mechanical cycling

K. Määttänen; A. Tuominen

The reliability of lead-free solder paste in mechanical cycling

K. Määttänen, A. Tuominen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	The reliability of lead-free solder paste in mechanical cycling
Original language	English
Title of host publication	Area Array Packaging Technologies, Fourth International Workshop on Area Array Packaging Technologies, April, 22-23, 2002, Berlin, Germany
Publisher	IEEE
Publication status	Published - 2002
Publication type	A4 Article in conference proceedings

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Cite this

@inproceedings{f14e82898d8545c4897f71249345145c,

title = "The reliability of lead-free solder paste in mechanical cycling",

author = "K. M{\"a}{\"a}tt{\"a}nen and A. Tuominen",

note = "Contribution: organisation=pori etp,FACT1=1",

year = "2002",

language = "English",

booktitle = "Area Array Packaging Technologies, Fourth International Workshop on Area Array Packaging Technologies, April, 22-23, 2002, Berlin, Germany",

publisher = "IEEE",

address = "United States",

}

TY - GEN

T1 - The reliability of lead-free solder paste in mechanical cycling

AU - Määttänen, K.

AU - Tuominen, A.

N1 - Contribution: organisation=pori etp,FACT1=1

PY - 2002

Y1 - 2002

M3 - Conference contribution

BT - Area Array Packaging Technologies, Fourth International Workshop on Area Array Packaging Technologies, April, 22-23, 2002, Berlin, Germany

PB - IEEE

ER -