Translated title of the contribution | Thermal Compact Modeling of a Stacked Multichip Module |
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Original language | English |
Title of host publication | ScandTherm 2002, First Scandinavian Conference on Cooling of Electronics, June 17, 2002, KTH, Stockholm, Sweden |
Editors | B. Palm |
Pages | 20-26 |
Publication status | Published - 2002 |
Publication type | B3 Article in conference proceedings |
Publication forum classification
- No publication forum level