Thermal Compact Modeling of a Stacked Multichip Module

V. Kyyhkynen, J. Valtanen, R. Heikkilä, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

Translated title of the contribution	Thermal Compact Modeling of a Stacked Multichip Module
Original language	English
Title of host publication	ScandTherm 2002, First Scandinavian Conference on Cooling of Electronics, June 17, 2002, KTH, Stockholm, Sweden
Editors	B. Palm
Pages	20-26
Publication status	Published - 2002
Publication type	B3 Article in conference proceedings

Publication forum classification

@inproceedings{61d91d3bc9de4764b8e69eec55b66921,

title = "Thermal Compact Modeling of a Stacked Multichip Module",

author = "V. Kyyhkynen and J. Valtanen and R. Heikkil{\"a} and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2002",

language = "English",

pages = "20--26",

editor = "B. Palm",

booktitle = "ScandTherm 2002, First Scandinavian Conference on Cooling of Electronics, June 17, 2002, KTH, Stockholm, Sweden",

}

TY - GEN

T1 - Thermal Compact Modeling of a Stacked Multichip Module

AU - Kyyhkynen, V.

AU - Valtanen, J.

AU - Heikkilä, R.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2002

Y1 - 2002

M3 - Conference contribution

SP - 20

EP - 26

BT - ScandTherm 2002, First Scandinavian Conference on Cooling of Electronics, June 17, 2002, KTH, Stockholm, Sweden

A2 - Palm, B.

ER -