Thermal Compact Modeling of a Stacked Multichip Module

V. Kyyhkynen, J. Valtanen, R. Heikkilä, E. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Translated title of the contributionThermal Compact Modeling of a Stacked Multichip Module
    Original languageEnglish
    Title of host publicationScandTherm 2002, First Scandinavian Conference on Cooling of Electronics, June 17, 2002, KTH, Stockholm, Sweden
    EditorsB. Palm
    Pages20-26
    Publication statusPublished - 2002
    Publication typeB3 Non-refereed article in conference proceedings

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