Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications

Sanna Lahokallio; Anniina Parviainen; Laura Frisk

Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications

Sanna Lahokallio, Anniina Parviainen, Laura Frisk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Translated title of the contribution	Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications
Original language	English
Title of host publication	EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France
Pages	1-6
Number of pages	6
Publication status	Published - 2013
Publication type	A4 Article in conference proceedings

Publication series

Name	European Microelectronics and Packaging Conference

Publication forum classification

Publication forum level 1

Access to Document

http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698641

Cite this

Lahokallio, S., Parviainen, A., & Frisk, L. (2013). Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications. In EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France (pp. 1-6). (European Microelectronics and Packaging Conference). http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698641

@inproceedings{cf5bcdff033c44fa9eca2d7a31e2fc2e,

title = "Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications",

author = "Sanna Lahokallio and Anniina Parviainen and Laura Frisk",

note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",

year = "2013",

language = "English",

isbn = "978-2-95-274671-7",

series = "European Microelectronics and Packaging Conference",

pages = "1--6",

booktitle = "EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France",

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Lahokallio, S, Parviainen, A & Frisk, L 2013, Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications. in EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France. European Microelectronics and Packaging Conference, pp. 1-6. <http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698641>

Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications. / Lahokallio, Sanna; Parviainen, Anniina; Frisk, Laura.

EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France. 2013. p. 1-6 (European Microelectronics and Packaging Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications

AU - Lahokallio, Sanna

AU - Parviainen, Anniina

AU - Frisk, Laura

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2013

Y1 - 2013

M3 - Conference contribution

SN - 978-2-95-274671-7

T3 - European Microelectronics and Packaging Conference

SP - 1

EP - 6

BT - EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France

ER -