Translated title of the contribution | Thermal RC - networks for accurate modeling of system-in-package |
---|---|
Original language | English |
Title of host publication | Pan Pacific Microelectronics Symposium, 25-27 January 2005, Kauai, Hawaii |
Pages | 61-65 |
Publication status | Published - 2005 |
Publication type | B3 Article in conference proceedings |
Publication forum classification
- No publication forum level