Thermal RC - networks for accurate modeling of system-in-package

K. Kaija, E. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Translated title of the contributionThermal RC - networks for accurate modeling of system-in-package
    Original languageEnglish
    Title of host publicationPan Pacific Microelectronics Symposium, 25-27 January 2005, Kauai, Hawaii
    Pages61-65
    Publication statusPublished - 2005
    Publication typeB3 Article in conference proceedings

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