Thermal shock resistance of adhesive flip chip joints

A. Seppälä, S. Nurmi, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Thermal shock resistance of adhesive flip chip joints
Original language	English
Title of host publication	Proceedings of Imaps Nordic, The 38th IMAPS Nordic Annual Conference, Hotel Olavsgaard, Oslo, Norway, 23-26 September 2001
Pages	287-291
Publication status	Published - 2001
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{360ee7dd310741a8b243453002d2b48d,

title = "Thermal shock resistance of adhesive flip chip joints",

author = "A. Sepp{\"a}l{\"a} and S. Nurmi and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

pages = "287--291",

booktitle = "Proceedings of Imaps Nordic, The 38th IMAPS Nordic Annual Conference, Hotel Olavsgaard, Oslo, Norway, 23-26 September 2001",

}