Thermomechanical properties of overmold epoxies in MEMS packaging

Mohammad Ali Fard Sanei, Janne Kiilunen, Juha Pippola, Sanna Lahokallio, Laura Frisk

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

    Original languageEnglish
    Title of host publicationProceedings of the IMAPS Nordic Annual Conference , June 8-9, 2015, Helsingør, Denmark
    PublisherIMAPS Nordic
    Pages175-179
    Number of pages5
    ISBN (Print)9781510808133
    Publication statusPublished - 2015
    Publication typeB3 Non-refereed article in conference proceedings
    EventInternational Microelectronics and Packaging Society Nordic Annual Conference -
    Duration: 1 Jan 1900 → …

    Conference

    ConferenceInternational Microelectronics and Packaging Society Nordic Annual Conference
    Period1/01/00 → …

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    • Publication forum level 0

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