Titanium Nitride Microelectrodes Deposited by Ion Beam Assisted E-beam Evaporation

Tomi Ryynänen, Maria Toivanen, Susanna Narkilahti, Jukka Lekkala

    Research output: Other conference contributionPaper, poster or abstractScientific

    Abstract

    An alternative method for fabricating titanium nitride (TiN) microelectrodes is presented. In order to decrease the impedance and noise levels of microelectrodes, one of the most common methods is to coat the electrodes with TiN. Usually that has required the use of a sputtering device, but we have demonstrated that also an e-beam coater can be used for TiN deposition, if equipped with an ion source. Our first 30 µm microelectrodes fabricated by ion beam assisted deposition (IBAD) have impedances around 75 kΩ, which is close to the impedances reported for sputter deposited TiN microelectrodes.
    Original languageEnglish
    DOIs
    Publication statusPublished - 24 Jun 2016
    EventMEA meeting 2016 -
    Duration: 28 Jun 20161 Jul 2016
    http://www.nmi.de/meameeting/

    Conference

    ConferenceMEA meeting 2016
    Period28/06/161/07/16
    Internet address

    Keywords

    • microelectrode
    • Titanium nitride
    • e-Beam evaporation
    • Ion beam assisted deposition
    • MEA

    Publication forum classification

    • No publication forum level

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