Towards fast product changeover in electronics assembly

I. Delamer

Towards fast product changeover in electronics assembly

I. Delamer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

Translated title of the contribution	Towards fast product changeover in electronics assembly
Original language	English
Title of host publication	IPC Printed Circuits Expo, APEX & the Designers Summit, Professional Development Course, Los Angeles Convention Center, February 18-22, 2007, Los Angeles, CA, USA
Pages	37 p
Publication status	Published - 2007
Publication type	B3 Article in conference proceedings

Publication forum classification

No publication forum level

Cite this

@inproceedings{a21e480d797d47a983928fcd7cbabe82,

title = "Towards fast product changeover in electronics assembly",

author = "I. Delamer",

note = "Contribution: organisation=ttek,FACT1=1",

year = "2007",

language = "English",

pages = "37 p",

booktitle = "IPC Printed Circuits Expo, APEX & the Designers Summit, Professional Development Course, Los Angeles Convention Center, February 18-22, 2007, Los Angeles, CA, USA",

}