Transient thermal characterization of a stacked multichip package

K. Kaija, P. Heino

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1 Citation (Scopus)

Translated title of the contribution	Transient thermal characterization of a stacked multichip package
Original language	English
Pages (from-to)	23-30
Journal	Journal of Microelectronics and Electronic Packaging
Volume	4
Issue number	1
Publication status	Published - 2007
Publication type	A1 Journal article-refereed

Publication forum classification

@article{798f292daa2948378020ced90cb8a6ce,

title = "Transient thermal characterization of a stacked multichip package",

author = "K. Kaija and P. Heino",

note = "Contribution: organisation=ele,FACT1=1",

year = "2007",

language = "English",

volume = "4",

pages = "23--30",

journal = "Journal of Microelectronics and Electronic Packaging",

issn = "1551-4897",

publisher = "IMAPS-International Microelectronics and Packaging Society",

number = "1",

}