Understanding the Causes of Microservice Logical Coupling: An Exploratory Study

Dario Amoroso D'Aragona, Xiaozhou Li, Andrea Janes

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

4 Downloads (Pure)

Abstract

When implementing a software system, two crucial metrics come into play: the degree of interdependence between modules, known as coupling, and the extent to which the components within a module collaborate to fulfill its task, referred to as cohesion. This paper studies the phenomenon of apparent coupling and explores the possibilities to exclude it from measurement when studying coupling between microservices.

Original languageEnglish
Title of host publicationProceedings - 2024 IEEE/ACM International Workshop New Trends in Software Architecture, SATrends 2024
PublisherACM
Pages14-17
Number of pages4
ISBN (Electronic)979-8-4007-0560-1
DOIs
Publication statusPublished - 2024
Publication typeA4 Article in conference proceedings
EventIEEE/ACM International Workshop New Trends in Software Architecture - Lisbon, Portugal
Duration: 14 Apr 202414 Apr 2024

Conference

ConferenceIEEE/ACM International Workshop New Trends in Software Architecture
Country/TerritoryPortugal
CityLisbon
Period14/04/2414/04/24

Keywords

  • commits
  • coupling
  • microservices
  • natural language processing
  • software quality

Publication forum classification

  • Publication forum level 1

ASJC Scopus subject areas

  • Hardware and Architecture
  • Software

Fingerprint

Dive into the research topics of 'Understanding the Causes of Microservice Logical Coupling: An Exploratory Study'. Together they form a unique fingerprint.

Cite this