Using JEDEC level 1 humidity life test method to qualify soldermask materials for flip chip applications

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Translated title of the contribution	Using JEDEC level 1 humidity life test method to qualify soldermask materials for flip chip applications
Original language	English
Pages (from-to)	16-18
Journal	Advancing Microelectronics
Issue number	May/June
Publication status	Published - 2000
Publication type	D1 Article in a trade journal

Publication forum classification

@article{9bf4afa5efda45bfaa7071633f181bcc,

title = "Using JEDEC level 1 humidity life test method to qualify soldermask materials for flip chip applications",

author = "P. Palm and J. M{\"a}{\"a}tt{\"a}nen and K. Puhakka and A. Tuominen",

note = "Contribution: organisation=pori etp,FACT1=1",

year = "2000",

language = "English",

pages = "16--18",

journal = "Advancing Microelectronics",

number = "May/June",

}

TY - JOUR

T1 - Using JEDEC level 1 humidity life test method to qualify soldermask materials for flip chip applications

AU - Palm, P.

AU - Määttänen, J.

AU - Puhakka, K.

AU - Tuominen, A.

N1 - Contribution: organisation=pori etp,FACT1=1

PY - 2000

Y1 - 2000

M3 - Article

SP - 16

EP - 18

JO - Advancing Microelectronics

JF - Advancing Microelectronics

IS - May/June

ER -