Utilising Modeling in a Reliability Study of ACA Joints in Humidity Tests

Kirsi Saarinen; Laura Frisk

Utilising Modeling in a Reliability Study of ACA Joints in Humidity Tests

Kirsi Saarinen, Laura Frisk

Research output: Contribution to journal › Article › Scientific › peer-review

Translated title of the contribution	Utilising Modeling in a Reliability Study of ACA Joints in Humidity Tests
Original language	English
Pages (from-to)	30-39
Number of pages	10
Journal	Journal of Microelectronics and Electronic Packaging
Volume	10
Issue number	1
Publication status	Published - 2013
Publication type	A1 Journal article-refereed

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Cite this

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title = "Utilising Modeling in a Reliability Study of ACA Joints in Humidity Tests",

author = "Kirsi Saarinen and Laura Frisk",

note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-10-29<br/>Publisher name: International Microelectronics and Packaging Society",

year = "2013",

language = "English",

volume = "10",

pages = "30--39",

journal = "Journal of Microelectronics and Electronic Packaging",

issn = "1551-4897",

publisher = "IMAPS-International Microelectronics and Packaging Society",

number = "1",

}

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T1 - Utilising Modeling in a Reliability Study of ACA Joints in Humidity Tests

AU - Saarinen, Kirsi

AU - Frisk, Laura

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-10-29<br/>Publisher name: International Microelectronics and Packaging Society

PY - 2013

Y1 - 2013

M3 - Article

SN - 1551-4897

VL - 10

SP - 30

EP - 39

JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

IS - 1

ER -