Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen; Matti Mäntysalo; Kimmo Kaija; Pauliina Mansikkamäki; Esa Kunnari; Katja Laine; Juha Niittynen; Santtu Koskinen; Eerik Halonen; Umur Caglar

doi:10.1016/j.mee.2010.04.013

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen, Matti Mäntysalo, Kimmo Kaija, Pauliina Mansikkamäki, Esa Kunnari, Katja Laine, Juha Niittynen, Santtu Koskinen, Eerik Halonen, Umur Caglar

Research output: Contribution to journal › Article › Scientific › peer-review

34 Citations (Scopus)

Translated title of the contribution	Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package
Original language	English
Pages (from-to)	2382-2390
Journal	Microelectronic Engineering
Volume	87
Issue number	11
DOIs	https://doi.org/10.1016/j.mee.2010.04.013
Publication status	Published - 2010
Publication type	A1 Journal article-refereed

Publication forum classification

Publication forum level 1

Access to Document

10.1016/j.mee.2010.04.013

Cite this

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title = "Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package",

author = "Ville Pekkanen and Matti M{\"a}ntysalo and Kimmo Kaija and Pauliina Mansikkam{\"a}ki and Esa Kunnari and Katja Laine and Juha Niittynen and Santtu Koskinen and Eerik Halonen and Umur Caglar",

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year = "2010",

doi = "10.1016/j.mee.2010.04.013",

language = "English",

volume = "87",

pages = "2382--2390",

journal = "Microelectronic Engineering",

issn = "0167-9317",

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T1 - Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

AU - Pekkanen, Ville

AU - Mäntysalo, Matti

AU - Kaija, Kimmo

AU - Mansikkamäki, Pauliina

AU - Kunnari, Esa

AU - Laine, Katja

AU - Niittynen, Juha

AU - Koskinen, Santtu

AU - Halonen, Eerik

AU - Caglar, Umur

N1 - Contribution: organisation=ele,FACT1=1

PY - 2010

Y1 - 2010

U2 - 10.1016/j.mee.2010.04.013

DO - 10.1016/j.mee.2010.04.013

M3 - Article

SN - 0167-9317

VL - 87

SP - 2382

EP - 2390

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 11

ER -