Verification of fluxes for flip chip assembly

A. Tuominen, V. Lehtinen, K. Kulojärvi, J. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

1 Citation (Scopus)

Translated title of the contribution	Verification of fluxes for flip chip assembly
Original language	English
Pages (from-to)	316-321
Journal	International journal of microcircuits and electronic packaging
Volume	21
Issue number	4
Publication status	Published - 1998
Publication type	A1 Journal article-refereed

Publication forum classification

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title = "Verification of fluxes for flip chip assembly",

author = "A. Tuominen and V. Lehtinen and K. Kuloj{\"a}rvi and J. Kivilahti",

note = "Contribution: organisation=pori ttp,FACT1=1",

year = "1998",

language = "English",

volume = "21",

pages = "316--321",

journal = "International journal of microcircuits and electronic packaging",

number = "4",

}

TY - JOUR

T1 - Verification of fluxes for flip chip assembly

AU - Tuominen, A.

AU - Lehtinen, V.

AU - Kulojärvi, K.

AU - Kivilahti, J.

N1 - Contribution: organisation=pori ttp,FACT1=1

PY - 1998

Y1 - 1998

M3 - Article

VL - 21

SP - 316

EP - 321

JO - International journal of microcircuits and electronic packaging

JF - International journal of microcircuits and electronic packaging

IS - 4

ER -