Verification of fluxes for flip chip assembly

A. Tuominen, V. Lehtinen, K. Kulojärvi, J. Kivilahti

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    Translated title of the contributionVerification of fluxes for flip chip assembly
    Original languageEnglish
    Pages (from-to)316-321
    JournalInternational journal of microcircuits and electronic packaging
    Issue number4
    Publication statusPublished - 1998
    Publication typeA1 Journal article-refereed

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