A Study on the Microstructure of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering

  • Laura Frisk (Invited lecturer)

    Aktiviteetti: Kutsuttu esitelmä

    Aikajakso2011
    Tapahtuman otsikkoThe IMAPS Nordic Annual Conference 2011, 5-8 June 2011, Espoo, Finland
    Tapahtuman tyyppiConference

    Country of activity

    • Ruotsi

    Publication forum classification

    • Ei tasoa