Keyphrases
Dynamic Strain Aging
100%
High Temperature
52%
Connector
51%
CAN Bus
51%
Microstructure Effect
48%
Ferritic-pearlitic Steel
44%
Split Hopkinson Pressure Bar
42%
Strain Rate
38%
Microstructure
35%
High Strain Rate
31%
Annealing
30%
Low Carbon
27%
Temperature Dynamics
25%
High Aluminum
25%
Stress-strain Curve
23%
Multiphase Steel
22%
Degradation Prognosis
22%
Maximum Strain
22%
Rutile
22%
Steel Composition
22%
Electrical Connector
22%
Material Behavior
22%
Tension Behavior
22%
Device-independent
22%
Dynamic Process
22%
Processing Parameters
22%
Humidity Conditions
22%
Steel Processing
22%
Compositional Parameters
22%
Numerical Modeling
22%
Medium Manganese Steel
22%
Direct Electrical Heating
22%
Glued Joints
22%
Display Glass
22%
High Temperature Tension
22%
Impact Test
22%
Strain Rate Dependent Materials
22%
Temperature-dependent Material
22%
Deterministic Model
22%
Microcracks
22%
Mobile Phone
22%
Boron Steel
22%
Degradation Modeling
22%
Probabilistic Model
22%
Dynamic Tension
22%
Stress Factors
22%
Penetration Depth
22%
Reliability Evaluation
22%
Serration
21%
Room Temperature
20%
Engineering
Dynamic Strain Aging
98%
Strain Rate
52%
Room Temperature
43%
High Strain Rate
41%
Manganese Steel
31%
Hopkinson
28%
Stress-Strain Curve
25%
Supplementary Information
22%
Processing Parameter
22%
Safety Issue
22%
Production Line
22%
Steel Composition
22%
Testing Temperature
22%
Degradation Process
22%
Matching Condition
22%
Numerical Modeling
22%
Glass Plate
22%
Exposure Condition
22%
Rock Drilling
22%
Microcracks
22%
Micro Crack
22%
Predictive Maintenance
22%
Data Transfer
22%
Rates of Strain
22%
Material Behavior
22%
Excavation Rock
22%
Dependent Material
22%
Reliability Evaluation
22%
Gauge Section
22%
Boron Steel
22%
Test Condition
22%
Strain Gage
22%
Impact Testing
22%
Degradation Model
22%
Stress Level
22%
Penetration Depth
22%
Dynamic Process
22%
Hot Working
22%
Data Collection
22%
Mobile Phones
22%
Joints (Structural Components)
22%
Electrical Heating
22%
Serration
21%
Split Hopkinson Pressure Bar
19%
Intercritical Annealing
17%
High Temperature Testing
15%
Forming Temperature
14%
High-Temperature System
14%
Material Model
14%
Digital Image Correlation
13%
