Additive Manufactured Compliant Surface Reflectance Sensor

Tutkimustuotos: KonferenssiartikkeliScientificvertaisarvioitu

10 Lataukset (Pure)

Abstrakti

In this paper1, we present an additive manufacturing (AM) method to implement structural electronics using an off-the-shelf fused deposition modeling (FDM) 3D printer with thermoplastic polyurethane (TPU) filament, conductive silver ink, and electronics components in standard packages. As a demonstrator, a surface reflectance sensor has been implemented. The structure consists of several 3D-printed TPU layers, 3D channels for the conductors, and cavities for components. A comparison is made between the performance of a traditional implementation on rigid PCB and the new sensor. The study shows that the chosen approach can be used for AM structural electronics.
AlkuperäiskieliEnglanti
Otsikko2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
KustantajaIEEE
Sivumäärä4
ISBN (elektroninen)978-1-6654-5733-0
ISBN (painettu)978-1-6654-9353-6
DOI - pysyväislinkit
TilaJulkaistu - 28 elok. 2023
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaIEEE International Conference on Flexible and Printable Sensors and Systems - Northeastern University - Interdisciplinary Science and Engineering Complex, Boston, Yhdysvallat
Kesto: 9 heinäk. 202312 heinäk. 2023
https://2023.ieee-fleps.org/

Julkaisusarja

NimiIEEE International Conference on Flexible and Printable Sensors and Systems
ISSN (painettu)2832-8248
ISSN (elektroninen)2832-8256

Conference

ConferenceIEEE International Conference on Flexible and Printable Sensors and Systems
LyhennettäFLEPS
Maa/AlueYhdysvallat
KaupunkiBoston
Ajanjakso9/07/2312/07/23
www-osoite

Julkaisufoorumi-taso

  • Jufo-taso 1

Sormenjälki

Sukella tutkimusaiheisiin 'Additive Manufactured Compliant Surface Reflectance Sensor'. Ne muodostavat yhdessä ainutlaatuisen sormenjäljen.

Siteeraa tätä