Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing

Julkaisun otsikon käännös: Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

11 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing
Alkuperäiskieli	Englanti
Otsikko	EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK
Julkaisupaikka	Piscataway, NJ
Kustantaja	IEEE
Sivut	1-6
Sivumäärä	6
ISBN (painettu)	978-1-4673-0694-2
Tila	Julkaistu - 2011
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Nimi	European Microelectronics & Packaging Conference EMPC
Kustantaja	IEEE

Julkaisufoorumi-taso

Lahokallio, Sanna ; Saarinen, Kirsi ; Frisk, Laura. / Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing. EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK. Piscataway, NJ : IEEE, 2011. Sivut 1-6 (European Microelectronics & Packaging Conference EMPC).

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title = "Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing",

author = "Sanna Lahokallio and Kirsi Saarinen and Laura Frisk",

note = "ei ut-numeroa 29.3.2014<br/>Contribution: organisation=ele,FACT1=1",

year = "2011",

language = "English",

isbn = "978-1-4673-0694-2",

series = "European Microelectronics \& Packaging Conference EMPC",

publisher = "IEEE",

pages = "1--6",

booktitle = "EMPC-2011 18th European Microelectronics \& Packaging Conference, 12th-15th September 2011, Brighton, UK",

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Lahokallio, S, Saarinen, K & Frisk, L 2011, Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing. julkaisussa EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK. European Microelectronics & Packaging Conference EMPC, IEEE, Piscataway, NJ, Sivut 1-6.

Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing. / Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura.
EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK. Piscataway, NJ: IEEE, 2011. s. 1-6 (European Microelectronics & Packaging Conference EMPC).

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

TY - GEN

T1 - Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing

AU - Lahokallio, Sanna

AU - Saarinen, Kirsi

AU - Frisk, Laura

N1 - ei ut-numeroa 29.3.2014<br/>Contribution: organisation=ele,FACT1=1

PY - 2011

Y1 - 2011

M3 - Conference contribution

SN - 978-1-4673-0694-2

T3 - European Microelectronics & Packaging Conference EMPC

SP - 1

EP - 6

BT - EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK

PB - IEEE

CY - Piscataway, NJ

ER -