@article{73809a59b41f4207810762e9118106d6,
title = "Comparison of induced stresses due to electroless versus sputtered copper interconnect technology",
author = "P.J. McNally and J. Kanatharana and B.H.W. Toh and D.W. McNeill and T. Tuomi and A.N. Danilewsky and L. Knuuttila and J. Riikonen and J. Toivonen",
note = "Contribution: organisation=fys,FACT1=1",
year = "2004",
doi = "10.1088/0268-1242/19/11/012",
language = "English",
volume = "19",
pages = "1280--1284",
journal = "Semiconductor Science and Technology",
issn = "0268-1242",
publisher = "IOP Publishing Ltd.",
number = "11",
}