Developing Actuation Mechanism for Stick-Slip Based Intelligent Mobile Displays

Ahmed Farooq, Philipp Weitz, Grigori Evreinov, Roope Raisamo, Daisuke Takahata

Tutkimustuotos: Konferenssiartikkeli › Scientific › vertaisarvioitu

Alkuperäiskieli	Englanti
Otsikko	Symposium on Design, Test, Integration and Packaging of MEMs / MOEMs (DTIP)
Toimittajat	Benoit Charlot
Kustantaja	IEEE
ISBN (painettu)	978-1-5386-2952-9
DOI - pysyväislinkit	https://doi.org/10.1109/DTIP.2017.7984488
Tila	Julkaistu - 2017
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Kesto: 1 tammik. 2017 → …

Conference	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Ajanjakso	1/01/17 → …

Julkaisufoorumi-taso

@inproceedings{574ce7bc158145489e2fc4e513c898fe,

title = "Developing Actuation Mechanism for Stick-Slip Based Intelligent Mobile Displays",

author = "Ahmed Farooq and Philipp Weitz and Grigori Evreinov and Roope Raisamo and Daisuke Takahata",

year = "2017",

doi = "10.1109/DTIP.2017.7984488",

language = "English",

isbn = "978-1-5386-2952-9",

editor = "Benoit Charlot",

booktitle = "Symposium on Design, Test, Integration and Packaging of MEMs / MOEMs (DTIP)",

publisher = "IEEE",

note = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Conference date: 01-01-2017",

}

Farooq, A, Weitz, P, Evreinov, G, Raisamo, R & Takahata, D 2017, Developing Actuation Mechanism for Stick-Slip Based Intelligent Mobile Displays. julkaisussa B Charlot (Toimittaja), Symposium on Design, Test, Integration and Packaging of MEMs / MOEMs (DTIP). IEEE, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 1/01/17. https://doi.org/10.1109/DTIP.2017.7984488

TY - GEN

T1 - Developing Actuation Mechanism for Stick-Slip Based Intelligent Mobile Displays

AU - Farooq, Ahmed

AU - Weitz, Philipp

AU - Evreinov, Grigori

AU - Raisamo, Roope

AU - Takahata, Daisuke

PY - 2017

Y1 - 2017

U2 - 10.1109/DTIP.2017.7984488

DO - 10.1109/DTIP.2017.7984488

M3 - Conference contribution

SN - 978-1-5386-2952-9

BT - Symposium on Design, Test, Integration and Packaging of MEMs / MOEMs (DTIP)

A2 - Charlot, Benoit

PB - IEEE

T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 1 January 2017

ER -