Dipole antennas 3D-printed from conductive thermoplastic filament

Zahangir Khan, Han He, Xiaochen Chen, Johanna Virkki

Tutkimustuotos: KonferenssiartikkeliScientificvertaisarvioitu

1 Sitaatiot (Scopus)
18 Lataukset (Pure)

Abstrakti

Fused Deposition Modeling (FDM) of thermoplastics is a flexible and simple 3D printing method. FDM has a variety of adjustable fabrication parameters to modify both the mechanical and electrical properties of the printed structures. However, the use of 3D-printable conductive thermoplastic filaments for electronics manufacturing has so far been quite limited. This type of printing would allow 3D-printed antennas to be efficiently embedded inside 3D-printed structures during the manufacturing process. In this paper, we present prototypes of 3D-printed dipole antennas using a conductive copper-based filament. Despite some initial challenges in the printing process, three types of ultrahigh frequency (UHF) radiofrequency identification (RFID) tag antennas were successfully printed, one of which was a contour pattern and the other two were printed using 100 % antenna patterns. Based on the achieved results, the thickness or printing pattern of the 3D-printed dipole antenna had no major effect on the tag read range. All types of tags showed read ranges of around 0.7-1.1 meters. Further, they were functional throughout the global UHF RFID frequency band (860-960 MHz). These first results are promising, especially when considering the contour type of antenna, which saves a lot of printing material and time.

AlkuperäiskieliEnglanti
Otsikko2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
AlaotsikkoProceedings
KustantajaIEEE
ISBN (elektroninen)978-1-7281-6293-5
ISBN (painettu)978-1-7281-6294-2
DOI - pysyväislinkit
TilaJulkaistu - syysk. 2020
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaIEEE Electronics System-Integration Technology Conference - Tonsberg, Vestfold, Norja
Kesto: 15 syysk. 202018 syysk. 2020

Julkaisusarja

Nimi Electronics System-Integration Technology Conference

Conference

ConferenceIEEE Electronics System-Integration Technology Conference
Maa/AlueNorja
KaupunkiTonsberg, Vestfold
Ajanjakso15/09/2018/09/20

Julkaisufoorumi-taso

  • Jufo-taso 1

!!ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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