Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA

J. Valtanen; P. Heino; E. Ristolainen

Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA

Julkaisun otsikon käännös: Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA

J. Valtanen
, P. Heino
, E. Ristolainen

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

Julkaisun otsikon käännös	Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA
Alkuperäiskieli	Englanti
Otsikko	IMAPS - Europe Cracow 2002, Proceedings on European Microelectronics Packaging & Interconnection Symposium, 16-18 June, 2002, Sofitel Hotel, Cracow, Poland
Sivut	284-288
Tila	Julkaistu - 2002
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

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@inproceedings{9610749433304af28e4d3498228b8c60,

title = "Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA",

author = "J. Valtanen and P. Heino and E. Ristolainen",

note = "ISBN 83-904462-7-8, CD-rom<br/>Contribution: organisation=ele,FACT1=1",

year = "2002",

language = "English",

pages = "284--288",

booktitle = "IMAPS - Europe Cracow 2002, Proceedings on European Microelectronics Packaging \& Interconnection Symposium, 16-18 June, 2002, Sofitel Hotel, Cracow, Poland",

}

TY - GEN

T1 - Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA

AU - Valtanen, J.

AU - Heino, P.

AU - Ristolainen, E.

N1 - ISBN 83-904462-7-8, CD-rom<br/>Contribution: organisation=ele,FACT1=1

PY - 2002

Y1 - 2002

M3 - Conference contribution

SP - 284

EP - 288

BT - IMAPS - Europe Cracow 2002, Proceedings on European Microelectronics Packaging & Interconnection Symposium, 16-18 June, 2002, Sofitel Hotel, Cracow, Poland

ER -