Evaluation of printed electronics manufacturing line with sensor platform application

Julkaisun otsikon käännös: Evaluation of printed electronics manufacturing line with sensor platform application

E. Halonen, K. Kaija, M. Mäntysalo, A. Kemppainen, R. Österbacka

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

11 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Evaluation of printed electronics manufacturing line with sensor platform application
Alkuperäiskieli	Englanti
Otsikko	EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15-18, 2009, Rimini, Italy
Sivut	8 p
Tila	Julkaistu - 2009
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

@inproceedings{00d6c7f0f1474e2b80e8f5799c896129,

title = "Evaluation of printed electronics manufacturing line with sensor platform application",

author = "E. Halonen and K. Kaija and M. M{\"a}ntysalo and A. Kemppainen and R. {\"O}sterbacka",

note = "Contribution: organisation=ele,FACT1=1",

year = "2009",

language = "English",

pages = "8 p",

booktitle = "EMPC2009, 17th European Microelectronics and Packaging Conference \& Exhibition, June 15-18, 2009, Rimini, Italy",

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TY - GEN

T1 - Evaluation of printed electronics manufacturing line with sensor platform application

AU - Halonen, E.

AU - Kaija, K.

AU - Mäntysalo, M.

AU - Kemppainen, A.

AU - Österbacka, R.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2009

Y1 - 2009

M3 - Conference contribution

SP - 8 p

BT - EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15-18, 2009, Rimini, Italy

ER -