Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability

Julkaisun otsikon käännös: Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability

Tutkimustuotos: Artikkeli › Tieteellinen › vertaisarvioitu

9 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability
Alkuperäiskieli	Englanti
Sivut	313-316
Sivumäärä	4
Julkaisu	Thin Solid Films
Vuosikerta	548
DOI - pysyväislinkit	https://doi.org/10.1016/j.tsf.2013.09.037
Tila	Julkaistu - 2013
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Julkaisufoorumi-taso

@article{abaf723ba5c64816abaa9f960e9cbd54,

title = "Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability",

author = "Mingde Pei and Bo Wang and Yunhui Tang and Xuemei Song and Hui Yan and Xiaoxue Zhang",

note = "Contribution: organisation=mol,FACT1=1<br/>Portfolio EDEND: 2013-11-29<br/>Publisher name: Elsevier",

year = "2013",

doi = "10.1016/j.tsf.2013.09.037",

language = "English",

volume = "548",

pages = "313--316",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability

AU - Pei, Mingde

AU - Wang, Bo

AU - Tang, Yunhui

AU - Song, Xuemei

AU - Yan, Hui

AU - Zhang, Xiaoxue

N1 - Contribution: organisation=mol,FACT1=1<br/>Portfolio EDEND: 2013-11-29<br/>Publisher name: Elsevier

PY - 2013

Y1 - 2013

U2 - 10.1016/j.tsf.2013.09.037

DO - 10.1016/j.tsf.2013.09.037

M3 - Article

SN - 0040-6090

VL - 548

SP - 313

EP - 316

JO - Thin Solid Films

JF - Thin Solid Films

ER -