Geometry Analysis in Screen-Printed Stretchable Interconnects

    Tutkimustuotos: ArtikkeliScientificvertaisarvioitu

    13 Sitaatiot (Scopus)

    Abstrakti

    Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.

    AlkuperäiskieliEnglanti
    Sivut1344-1352
    JulkaisuIEEE Transactions on Components, Packaging and Manufacturing Technology
    Vuosikerta8
    Numero8
    Varhainen verkossa julkaisun päivämäärä8 heinäk. 2018
    DOI - pysyväislinkit
    TilaJulkaistu - elok. 2018
    OKM-julkaisutyyppiA1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

    Julkaisufoorumi-taso

    • Jufo-taso 1

    !!ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Industrial and Manufacturing Engineering
    • Electrical and Electronic Engineering

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