Hermetic and radiation tolerant glass package for vcsels using novel micro bonding method

H. Lunden, A. Maattanen, I. Oxtoby

Tutkimustuotos: KonferenssiartikkeliScientificvertaisarvioitu

Abstrakti

In this study, we use novel glass micro bonding method to manufacture hermetic and radiation tolerant all-in-glass packages for vertical cavity surface emitting lasers (VCSEL) suitable for space applications. Thermal analysis demonstrates that the properties of the designed Leadless Glass Package (LGP) are well-suited for the intended conditions, even at higher temperatures than required. Evaluation tests show excellent device functionality and robust package structure. The same design could easily be adapted to other glass types, such as Borofloat 33, and end applications such as MEMS and active implants. The assembly design and technologies are well-suited for commercial volume scale manufacturing.

AlkuperäiskieliEnglanti
Otsikko2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
ISBN (elektroninen)9780956808660
DOI - pysyväislinkit
TilaJulkaistu - 16 syysk. 2019
Julkaistu ulkoisestiKyllä
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
Tapahtuma22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 - Pisa, Italia
Kesto: 16 syysk. 201919 syysk. 2019

Julkaisusarja

Nimi2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019

Conference

Conference22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Maa/AlueItalia
KaupunkiPisa
Ajanjakso16/09/1919/09/19

!!ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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