High-resolution E-jet Enhanced MEMS Packaging

High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).