Hydrolysis testing of ACF joined flip chip components with conformal coating

Julkaisun otsikon käännös: Hydrolysis testing of ACF joined flip chip components with conformal coating

K. Kokko, H. Harjunpää, P. Heino, M. Kellomäki

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen

1 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Hydrolysis testing of ACF joined flip chip components with conformal coating
Alkuperäiskieli	Englanti
Otsikko	EMPC2009. 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy
Sivut	6 p
Tila	Julkaistu - 2009
OKM-julkaisutyyppi	B3 Vertaisarvioimaton artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

@inproceedings{90a28768aca94746b79613167fc4409f,

title = "Hydrolysis testing of ACF joined flip chip components with conformal coating",

author = "K. Kokko and H. Harjunp{\"a}{\"a} and P. Heino and M. Kellom{\"a}ki",

note = "ELE 50\% - BME 50\%<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=bme,FACT2=0.5",

year = "2009",

language = "English",

pages = "6 p",

booktitle = "EMPC2009. 17th European Microelectronics and Packaging Conference \& Exhibition, June 15 - 18, 2009, Rimini, Italy",

}

TY - GEN

T1 - Hydrolysis testing of ACF joined flip chip components with conformal coating

AU - Kokko, K.

AU - Harjunpää, H.

AU - Heino, P.

AU - Kellomäki, M.

N1 - ELE 50% - BME 50%<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=bme,FACT2=0.5

PY - 2009

Y1 - 2009

M3 - Conference contribution

SP - 6 p

BT - EMPC2009. 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy

ER -