Inkjet Filling of TSVs with Silver Nanoparticle Ink

Behnam Khorramdel; Matti Mäntysalo

doi:10.1109/ESTC.2014.6962741

Inkjet Filling of TSVs with Silver Nanoparticle Ink

Julkaisun otsikon käännös: Inkjet Filling of TSVs with Silver Nanoparticle Ink

Behnam Khorramdel, Matti Mäntysalo

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

15 Sitaatiot (Scopus)

15 Lataukset (Pure)

Julkaisun otsikon käännös	Inkjet Filling of TSVs with Silver Nanoparticle Ink
Alkuperäiskieli	Englanti
Otsikko	2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland
Kustantaja	IEEE
Sivut	1-5
Sivumäärä	5
ISBN (painettu)	978-1-4799-4026-4
DOI - pysyväislinkit	https://doi.org/10.1109/ESTC.2014.6962741
Tila	Julkaistu - 2014
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Electronics System-Integration Technology Conference - Kesto: 1 tammik. 2014 → …

Conference

Conference	Electronics System-Integration Technology Conference
Ajanjakso	1/01/14 → …

Julkaisufoorumi-taso

Jufo-taso 1

Pääsy asiakirjaan

10.1109/ESTC.2014.6962741

Khorramdel_Mantysalo_2014_Inkjet_filling_of_TSVs_with_silver_nanoparticle_ink-1
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Accepted author manuscript, 284 KBLisenssi: Unspecified

https://urn.fi/URN:NBN:fi:tuni-202310198933Lisenssi: Unspecified

Siteeraa tätä

@inproceedings{c1773ad94c7146ef8aca912439fd35b2,

title = "Inkjet Filling of TSVs with Silver Nanoparticle Ink",

author = "Behnam Khorramdel and Matti M{\"a}ntysalo",

note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-11-10<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronics System-Integration Technology Conference ; Conference date: 01-01-2014",

year = "2014",

doi = "10.1109/ESTC.2014.6962741",

language = "English",

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TY - GEN

T1 - Inkjet Filling of TSVs with Silver Nanoparticle Ink

AU - Khorramdel, Behnam

AU - Mäntysalo, Matti

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-11-10<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2014

Y1 - 2014

U2 - 10.1109/ESTC.2014.6962741

DO - 10.1109/ESTC.2014.6962741

M3 - Conference contribution

SN - 978-1-4799-4026-4

SP - 1

EP - 5

BT - 2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland

PB - IEEE

T2 - Electronics System-Integration Technology Conference

Y2 - 1 January 2014

ER -