Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Ayat Soltani; Tero Kumpulainen; Matti Mäntysalo

doi:10.1109/ECTC.2014.6897523

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Julkaisun otsikon käännös: Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Ayat Soltani, Tero Kumpulainen, Matti Mäntysalo

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

8 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
Alkuperäiskieli	Englanti
Otsikko	2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL
Kustantaja	IEEE
Sivut	1685-1689
Sivumäärä	5
ISBN (painettu)	978-1-4799-2407-3
DOI - pysyväislinkit	https://doi.org/10.1109/ECTC.2014.6897523
Tila	Julkaistu - 2014
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Electronic Components and Technology Conference - Kesto: 1 tammik. 2014 → …

Conference

Conference	Electronic Components and Technology Conference
Ajanjakso	1/01/14 → …

Julkaisufoorumi-taso

Jufo-taso 1

Pääsy asiakirjaan

10.1109/ECTC.2014.6897523

8 Viittaukset
1 Artikkeli

Laser sintering of copper nanoparticles on top of silicon substrates
Soltani, A., Khorramdel, B., Mardoukhi, A. & Mäntysalo, M., 9 jouluk. 2015, julkaisussa: Nanotechnology. 27, 3, 5 Sivumäärä, 035203.
Tutkimustuotos: Artikkeli › Tieteellinen › vertaisarvioitu

Open access
Tiedosto
34 Sitaatiot (Scopus)

149 Lataukset (Pure)

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@inproceedings{2110969a16bc493c8b9cddd6390b5c78,

title = "Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer",

author = "Ayat Soltani and Tero Kumpulainen and Matti M{\"a}ntysalo",

note = "Contribution: organisation=elt,FACT1=0.9 Contribution: organisation=mei,FACT2=0.1 Portfolio EDEND: 2014-10-09 Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronic Components and Technology Conference ; Conference date: 01-01-2014",

year = "2014",

doi = "10.1109/ECTC.2014.6897523",

language = "English",

isbn = "978-1-4799-2407-3",

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booktitle = "2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL",

publisher = "IEEE",

address = "United States",

}

Soltani, A, Kumpulainen, T & Mäntysalo, M 2014, Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer. julkaisussa 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. IEEE, Sivut 1685-1689, Electronic Components and Technology Conference, 1/01/14. https://doi.org/10.1109/ECTC.2014.6897523

TY - GEN

T1 - Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

AU - Soltani, Ayat

AU - Kumpulainen, Tero

AU - Mäntysalo, Matti

N1 - Contribution: organisation=elt,FACT1=0.9 Contribution: organisation=mei,FACT2=0.1 Portfolio EDEND: 2014-10-09 Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2014

Y1 - 2014

U2 - 10.1109/ECTC.2014.6897523

DO - 10.1109/ECTC.2014.6897523

M3 - Conference contribution

SN - 978-1-4799-2407-3

SP - 1685

EP - 1689

BT - 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 2014

ER -

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Conference

Julkaisufoorumi-taso

Pääsy asiakirjaan

Tutkimustuotos

Laser sintering of copper nanoparticles on top of silicon substrates

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