Inkjet printed single layer high-density circuitry for a MEMS device

Mika-Matti Laurila; Ayat Soltani; Matti Mäntysalo

doi:10.1109/ECTC.2015.7159712

Inkjet printed single layer high-density circuitry for a MEMS device

Mika-Matti Laurila, Ayat Soltani, Matti Mäntysalo

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

9 Sitaatiot (Scopus)

23 Lataukset (Pure)

Abstrakti

For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.

Alkuperäiskieli	Englanti
Otsikko	2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Kustantaja	IEEE
Sivut	968-972
Sivumäärä	5
ISBN (painettu)	9781479986095
DOI - pysyväislinkit	https://doi.org/10.1109/ECTC.2015.7159712
Tila	Julkaistu - 15 heinäk. 2015
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	IEEE Electronic Components and Technology Conference - , Yhdysvallat Kesto: 1 tammik. 2000 → …

Conference

Conference	IEEE Electronic Components and Technology Conference
Maa/Alue	Yhdysvallat
Ajanjakso	1/01/00 → …

Julkaisufoorumi-taso

Jufo-taso 1

!!ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Pääsy asiakirjaan

10.1109/ECTC.2015.7159712

Inkjet printed single layer high-density 2015
This publication is copyrighted. You may download, display and print it for Your own personal use. Commercial use is prohibited.
Accepted author manuscript, 2,29 MB

http://urn.fi/URN:NBN:fi:tuni-202106045665

9 Viittaukset
1 Artikkeli

Laser sintering of copper nanoparticles on top of silicon substrates
Soltani, A., Khorramdel, B., Mardoukhi, A. & Mäntysalo, M., 9 jouluk. 2015, julkaisussa: Nanotechnology. 27, 3, 5 Sivumäärä, 035203.
Tutkimustuotos: Artikkeli › Tieteellinen › vertaisarvioitu

Open access
Tiedosto
34 Sitaatiot (Scopus)

149 Lataukset (Pure)

Siteeraa tätä

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title = "Inkjet printed single layer high-density circuitry for a MEMS device",

abstract = "For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.",

author = "Mika-Matti Laurila and Ayat Soltani and Matti M{\"a}ntysalo",

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N2 - For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.

AB - For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.

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DO - 10.1109/ECTC.2015.7159712

M3 - Conference contribution

AN - SCOPUS:84942107842

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EP - 972

BT - 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

PB - IEEE

T2 - IEEE Electronic Components and Technology Conference

Y2 - 1 January 2000

ER -

Inkjet printed single layer high-density circuitry for a MEMS device

Abstrakti

Conference

Julkaisufoorumi-taso

!!ASJC Scopus subject areas

Pääsy asiakirjaan

Sormenjälki

Tutkimustuotos

Laser sintering of copper nanoparticles on top of silicon substrates

Siteeraa tätä